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NEC's 870 MHz GaAs CATV MC-7847-KC 25 dB POWER DOUBLER AMPLIFIER
FEATURES
* GaAs ACTIVE DEVICES * LOW DISTORTION * HIGH LINEAR GAIN: MC-7847-KC - GL = 25 dB MIN at f = 870 MHz * LOW RETURN LOSS * LOW GAIN CHANGE OVER TEMPERATURE * SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE * HIGH RELIABILITY AND RUGGEDNESS: Withstands environmental extremes as well as Silicon devices (Surge, ESD, Etc.)
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE H02
45.08 MAX 38.10.25 3.2 MAX 27.5 MAX 4.25
+ 0.25 - 0.35
14.85 MAX 4.00.25 8.1 MAX 19.050.38 1 In 6-32 unc 2B
VDD 5 9 Out
25.40.25 2.540.25
2378 0.510.05 21.5 MAX Gnd
2.620.35
DESCRIPTION
NEC's MC-7847-KC is a GaAs Multi-Chip Modules designed for use as output stages in CATV applications up to 870 MHz. This is a high gain device offering 25 dB minimum gain at 870 MHz. Because this unit is a GaAs device it has low distortion, low noise figure, and low return loss across the entire frequency band. The MC-7847-KC is similar to NEC's standard push-pull devices, but the higher current allows for better distortion performance, especially X-mod. Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using fully automated equipment to maximize consistency in part to part performance, and reliability is assured by NEC's stringent quality and process control procedures. These parts come in industry compatible hybrid packages.
4.190.13 A 0.38.. A 0.510.05
12.9 MAX
123 5
789
10.75 0.25
2.54 0.38 6.3 2.5
0.05
APPLICATIONS
* CATV HEADEND SYSTEMS * CATV OPTICAL NODES * CATV DISTRIBUTION AMPS
ELECTRICAL CHARACTERISTICS (TA = 305 C, VDD = 24 V, ZS = ZL = 75 )
PART NUMBER SYMBOLS BW GL S Gf NF RLi CHARACTERISTICS Frequency Range Linear Gain Gain Slope Gain Flatness Noise Figure 1 Noise Figure 2 Input Return Loss UNITS MHz dB dB dB dB dB MIN 50 25.0 1.0 - - - 20.0 20.0 19.5 17.0 20.0 350 - - - MC-7847-KC TYP - - 1.4 - - - - - - - - - - - - MAX 870 26.0 1.8 0.6 5.5 6.0 - - - - - 420 -60 -55 -63 TEST CONDITIONS
RLO IDD CTB XMod CSO
Output Return Loss Operating Current Composite Triple Beat Cross Modulation1 Composite Second Order
mA mA dBc dBc dBc
f = 870 MHz f = 40 to 870 MHz 40 to 870 MHz; Peak to Valley f = 50 MHz f = 870 MHz 40 to 160MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz 40 to 160MHz RF OFF 110 Channels VOUT = 50 dBmV at 745.25 MHz, 10 dB tilted across the band
1. Measured per US standard methods and procedures (using selective level meter).
California Eastern Laboratories
MC-7847-KC ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 C)
SYMBOLS VDD VI TC TSTG PARAMETERS Supply Voltage Input Voltage (Single Tone)2 Operating Case Temperature Storage Temperature UNITS V dBmV C C RATINGS 30 65 -30 to +100 -40 to +100 TC
RECOMMENDED OPERATING CONDITIONS (Zs = ZL = 75)
SYMBOLS VDD Vi PARAMETERS Supply VoltageV Input Voltage1, MC-7847-KC Operating Case Temperature dBmV C - -30 32.0 +25 35.0 +85 UNITS MIN 23.5 24.0 TYP MAX 24.5
Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance.
Note: 1. Test Conditions: 110 Channels, 10 dB tilted across the band.
ORDERING INFORMATION
PART NUMBER MC-7847-KC PACKAGE 7-pin special with heatsink QUANTITY 50pcs max/ Tray
NOTES ON CORRECT USE
1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. Recommended space is 2.0 to 3.0 mm typical. 2. Recommended torque strength of the screw is 59 to 78 Ncm. 3. Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering Method Pin Part Heating Soldering Conditions Pin area temperature: less than 260C1 Hour: Within 2 sec./pin Condition Symbol -
Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead.
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
01/28/2004

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